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G2 Automated
Technologies,
LLC. has been
manufacturing
wafer handling
equipment and
clean room
furnishings
since 1999. We
would like to
thank our many
clients for
their continued
support. G2
Automated
Technologies,
LLC. offers all
of the following
at our corporate
location in
Richardson,
Texas:
Manufacturing,
Engineering,
Product Design
and Development,
Training, Sales
and Service.
more
College
/
University
Stainless
Steel
Equipment
 |
Medical
Facilities
Storage
and
Furnishings
 |
Industrial
Applications
Carts,
Storage,
& more
 |
Prototype
Engineering
Custom
Automation
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[7.2.2009]
Printable Electronics Hits Display Needs.
Traditional LCDs are transmissive devices, where "aperturing" — the blocking of transmitted light by the thin-film transistor (TFT) and interconnects — can reduce the light output by 30-50%. To keep the TFT small, line widths and alignment tolerances must be minimized, putting a huge premium on advanced photolithography tools.
Two different printable displays were discussed at SID 2009: active-matrix light-emitting diodes (AMOLEDs) for laptop computers and electrophoretic displays for E-books
more
[6.11.2009]
Control Strategy for Wafer-Edge Defects
Defect inspections and monitoring are only performed on complete die. Partially printed die at the perimeter of a wafer include only a portion of a full chip, and thus are unusable as product. However, we have determined that inspecting partial die can reveal defect signatures that point to process issues relevant to the full, yielding die. Inspections that include complete wafer information — both full and partial die — provide engineers with a comprehensive picture of a particular process and the associated defectivity.
more
[6.1.2009]
Emerging Trends in Advanced Packaging
Among the many packaging challenges that must be addressed is the continued development of powerful co-design tools to shorten development cycles, and enhance
performance and reliability. Continued pitch reductions and the use of 3-D package interconnects in single-chip and multichip components, and IC integration with sensors, energy harvesting and biomedical devices require packaging materials that are low cost and can be easily processed.
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